MS-11 Solder Paste Inspection Machine

MIRTEC MS-11 IS PREMIUM 3D SPI FOR SMT/SEMI
MIRTEC has implemented a next-generation vision system featuring 4㎛/6㎛ high-resolution lenses for greater precision and stability in inspection. Additionally, the CoaXPress interface enables high-speed inspection, while the 25M high-resolution camera provides a large field of view (FOV) for enhanced performance.

With dramatic improvement of accuracy & repeatability by S/W & H/W renovation, the MS-11 can precisely measure and inspect solder paste on Mini-LED chips as small as 0201mm, with a designated height of 30㎛. 

Many 3D SPI systems on the market use conventional lenses, which cause image distortion. All of Mirtec 3D SPI systems are equipped with telecentric lenses, eliminating image errors caused by perspective distortion and ensuring highly precise 3D inspections.

The MS-11 SPI machine detects and automatically compensates for PCB warpage up to 士5mm within its field of view (FOV) using the Z-axis, while capturing the board images. This ensures accurate inspection and guarantees precise 3D measurement results even for bent PCBs regardless of their warpage condition.

MIRTEC's SSF (Solder Supplying Function) automatically supplies solder onto insufficient or missing pads using a solder dispenser integrated into the optical system after inspection